In Memoriam William Hsun HuView this Special Issue
E. C. H. Lim, B. J. Duggan, "On Sub-Structure and Texture Development in Warm Rolled Copper", Texture, Stress, and Microstructure, vol. 26, Article ID 968963, 12 pages, 1996. https://doi.org/10.1155/TSM.26-27.125
On Sub-Structure and Texture Development in Warm Rolled Copper
Preliminary results on the effects of rolling strain rate and deformation temperature on warm rolled copper are presented. It is shown that in single pass rolling the textures are less intense than those produced by homogeneous rolling over the temperature range 30℃–500℃. Deformation banding is present in homogeneous rolling at room temperature and in single pass rolling at 500℃ and is drastically reduced in single pass rolling at 30℃–350℃. The results are discussed in terms of slab widening, rate and temperature effects on slip processes.
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