Texture, Stress, and Microstructure

Texture, Stress, and Microstructure / 1996 / Article
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In Memoriam William Hsun Hu

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Volume 26 |Article ID 968963 | https://doi.org/10.1155/TSM.26-27.125

E. C. H. Lim, B. J. Duggan, "On Sub-Structure and Texture Development in Warm Rolled Copper", Texture, Stress, and Microstructure, vol. 26, Article ID 968963, 12 pages, 1996. https://doi.org/10.1155/TSM.26-27.125

On Sub-Structure and Texture Development in Warm Rolled Copper

Received20 Jan 1996

Abstract

Preliminary results on the effects of rolling strain rate and deformation temperature on warm rolled copper are presented. It is shown that in single pass rolling the textures are less intense than those produced by homogeneous rolling over the temperature range 30℃–500℃. Deformation banding is present in homogeneous rolling at room temperature and in single pass rolling at 500℃ and is drastically reduced in single pass rolling at 30℃–350℃. The results are discussed in terms of slab widening, rate and temperature effects on slip processes.

Copyright © 1996 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


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