Table of Contents
Textures and Microstructures
Volume 26 (1996)–27

On Sub-Structure and Texture Development in Warm Rolled Copper

Department of Mechanical Engineering, University of Hong Kong, Pokfulam Road, Hong Kong, China

Received 20 January 1996

Copyright © 1996 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Preliminary results on the effects of rolling strain rate and deformation temperature on warm rolled copper are presented. It is shown that in single pass rolling the textures are less intense than those produced by homogeneous rolling over the temperature range 30℃–500℃. Deformation banding is present in homogeneous rolling at room temperature and in single pass rolling at 500℃ and is drastically reduced in single pass rolling at 30℃–350℃. The results are discussed in terms of slab widening, rate and temperature effects on slip processes.