Table of Contents
Textures and Microstructures
Volume 31, Issue 1-2, Pages 85-95
http://dx.doi.org/10.1155/TSM.31.85

Modelling the Effect of Plastic Anisotropy on Springback of Integrated Circuit Leadframes

Department of Manufacturing Engineering, The Hong Kong Polytechnic University, Yuk Choi Road, Hung Hom, Kowloon, Hong Kong

Received 19 August 1998

Copyright © 1998 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

K. C. Chan and S. H. Wang, “Modelling the Effect of Plastic Anisotropy on Springback of Integrated Circuit Leadframes,” Textures and Microstructures, vol. 31, no. 1-2, pp. 85-95, 1998. https://doi.org/10.1155/TSM.31.85.