Texture, Stress, and Microstructure

Texture, Stress, and Microstructure / 1999 / Article
Special Issue

Proceedings of the International Conference: Texture and Properties of Materials

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Open Access

Volume 32 |Article ID 414319 | https://doi.org/10.1155/TSM.32.321

I. V. Alexandrov, V. N. Serebryany, L. N. Sarvarova, M. V. Alexandrova, R. Z. Valiev, "Texture and Young's Modulus Anisotropy in Nanostructured Copper", Texture, Stress, and Microstructure, vol. 32, Article ID 414319, 19 pages, 1999. https://doi.org/10.1155/TSM.32.321

Texture and Young's Modulus Anisotropy in Nanostructured Copper

Accepted28 Sep 1997


It was shown that in ultrafine-grained nanostructured Cu processed by severe plastic deformation and subjected to cold rolling and annealing, the level and character of Young's modulus anisotropy is significantly different from values corresponding to cold rolled and annealed coarse-grained Cu. The crystallographic texture formation processes are investigated in these states in parallel. The comparative study of the elastic behaviour and crystallographic texture lets us draw conclusions concerning the leading role of not only developing crystallographic texture but a specific defect structure of grain boundaries as well in the formation of unusual elastic properties of ultrafine-grained materials processed by severe plastic deformation.

Copyright © 1999 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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