In this study, the development of the microstructure of zinc&#x2013;iron and zinc&#x2013;nickel coatings
on steel sheet electrodeposited at various deposition conditions, is analyzed. The evolution
of the coating microstructure &#x2013; texture, surface morphology, crystallographic lattice,
microstress, alloy composition and phase of coatings &#x2013; is investigated at different current
densities and deposition times. The microstructure of zinc alloy coatings varies significantly
with the change of deposition parameters. The present study proposes that the transformarion
of texture during the alloy codeposition is closely related to the morphological
characteristics of the coating surface and the change of alloy and phase composition of the
deposit. Anomalous codeposition behavior, is considered responsible for the change or
transformation of the microstructure of coatings. The texture of zinc&#x2013;iron coatings
changes from the combined texture of the basal fiber and non-fiber pyramidal component
to the pyramidal fiber texture with the current density increase. In the case of zinc&#x2013;nickel
coatings, the intensity of the &#x7B;101&#x7D; texture of &#x3B3; phase increases with increasing nickel
content, while the intensity of the &#x7B;100&#x7D; texture decreases. A correlation between the
texture, morphology and alloy content in the deposits is discussed.

H. Park

J. A. Szpunar

The Microstructural Characterization of Electrogalvanized
Zinc&#x2013;Iron and Zinc&#x2013;Nickel Coatings

The electroless Ni&#x2013;Co&#x2013;P alloy films containing up to 13.4&#x25; Co and 7.6&#x25; P were
deposited on a 5086 aluminum alloy sheet using baths consisting of NiSO4, CoSO4,
(NH4)2SO4, NaH2PO2, sodium citrate and thiourea. The deposits were solid solutions
having a grain size of 6&#x2013;7 nm and strong <mml:math id="E1" xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mrow><mml:mrow><mml:mo>&#x2329;</mml:mo><mml:mrow><mml:mn>111</mml:mn></mml:mrow><mml:mo>&#x0232A;</mml:mo></mml:mrow></mml:mrow></mml:math> texture. When the deposits were annealed
for 2 h, Ni5P2 was precipitated at 325&#xB0;C and transformed into the stable Ni3P phase at
higher temperatures. During annealing the texture of deposit changed from <mml:math id="E2" xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mrow><mml:mrow><mml:mo>&#x2329;</mml:mo><mml:mrow><mml:mn>111</mml:mn></mml:mrow><mml:mo>&#x0232A;</mml:mo></mml:mrow></mml:mrow></mml:math> to <mml:math id="E3" xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mrow><mml:mrow><mml:mo>&#x2329;</mml:mo><mml:mrow><mml:mn>100</mml:mn></mml:mrow><mml:mo>&#x0232A;</mml:mo></mml:mrow></mml:mrow></mml:math>.
The texture change was attributed to preferential growth of <mml:math id="E4" xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mrow><mml:mrow><mml:mo>&#x2329;</mml:mo><mml:mrow><mml:mn>100</mml:mn></mml:mrow><mml:mo>&#x0232A;</mml:mo></mml:mrow></mml:mrow></mml:math> grains at the expense of
<mml:math id="E5" xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mrow><mml:mrow><mml:mo>&#x2329;</mml:mo><mml:mrow><mml:mn>111</mml:mn></mml:mrow><mml:mo>&#x0232A;</mml:mo></mml:mrow></mml:mrow></mml:math> grains to decrease the thermal strain energy of the deposits. On the other hand, the
electroless Ni&#x2013;Cu&#x2013;P alloy films containing Cu and P deposited on 5086 aluminum alloy
sheet had the microstructures and textures which are similar to these of the Ni&#x2013;Co&#x2013;P
alloy films. However, their initial <mml:math id="E6" xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mrow><mml:mrow><mml:mo>&#x2329;</mml:mo><mml:mrow><mml:mn>111</mml:mn></mml:mrow><mml:mo>&#x0232A;</mml:mo></mml:mrow></mml:mrow></mml:math> texture remained relatively stable even after
annealing. The differences in annealing textures of Ni&#x2013;Co&#x2013;P and Ni&#x2013;Cu&#x2013;P alloy films
have been discussed.

Dong Nyung Lee

Kang-Heon Hur

The Evolution of Texture During Annealing of Nanocrystalline
Electroless Nickel Alloy Deposits

A computer model is developed which is capable of simulating the texture and microstructure of the oxide grown on a Zr substrate. In this computer model, the effects of both substrate texture and microstructure in the formation of oxide texture and microstructure are taken into account. The substrate and oxide are represented with digitized unit cells. Each unit cell has an orientation characterized by three Euler angles. In the nucleation and
re-nucleation stage, the orientation of each oxide cell is determined by substrate orientation and microstructure. In the oxide grain growth stage, the orientation of each oxide cell is determined by minimizing the stress at the oxide&#x2F;metal interface. In this paper, the model is applied to the simulation of the texture formation of the ZrO2 grown on a Zr&#x2013;2.5&#x25;Nb substrate. Three substrates with completely different orientations and microstructures are used in the study. Good agreement between the simulated and the experimental results is obtained.

H. Li

M. Glavicic

Simulation of Texture Formation in a ZrO2 Film Grown on Zr&#x2013;2.5&#x25;Nb

Jerzy A. Szpunar

Texture in Films and Coatings

The development of texture in thin films under ion bombardment is believed to occur due to
the preferential growth of the aligned grains in the film relative to the unaligned grains. The
difference in growth rates between aligned and unaligned grains results in the development
of texture with increasing thickness. Both out-of-plane (fiber) and in-plane texture can be
controlled during ion bombardment. Experiments were performed to create a (110) out-of-plane
texture in thin aluminum films and to create a (110) in-plane texture in niobium films.
Results showed that the texture in both cases increases in strength with depth, and that for
500 nm Al films, the (110) texture was stronger than the thermodynamically-preferred (111)
texture obtained by physical vapor deposition. Results confirm a texturing mechanism
based on ion channeling and preferential sputtering.

G. S. Was

H. Ji

Z. Ma

Texture Control in Thin Films Using Ion Bombardment

Improvement in the understanding of the influence of crystallographic texture on the
diffusion behavior of protective oxides, formed at high temperatures on metallic substrates,
is being sought through the study of a simple model system such as nickel&#x2013;nickel
oxide. Examples of textures in metallurgical nickel products and the correlation between
the substrate and oxide textures, are discussed. Techniques of surface texturing are suggested
and the texture leading to the highest oxidation resistance is selected on the basis of
existing experimental evidence.

F. Czerwinski

The Growth of Oxide Scales on Textured Nickel

Films consisting of Mo, Cr, and Ta have all been found to display well-defined biaxial
textures when grown under certain conditions. A well-defined out-of-plane texture evolves
within the first &#x7E; 100 nm of the film, followed by the evolution of a preferred crystallographic
orientation in the plane of the film. These effect were studied using X-ray pole figure
analysis, scanning electron microscopy (SEM), transmission electron microscopy
(TEM), transmission electron diffraction (TED), and high resolution grazing incidence
X-ray scattering (GIXS). It has been found that in-plane texture evolves only when there
is, on average, oblique adatom flux incident onto the substrate. Further, the type of out-of-plane texture can be controlled by altering the deposition conditions. Parameters including cathode-to-substrate distance, deposition rate, average angle of adatom incidence,
and sputter gas pressure, have been shown to determine the type out-of-plane
texture, as well as the rate of in-plane texture evolution. The studies conducted have shown
that it is possible to create and control biaxially textured films and multilayers made of a
variety of materials. A recent model which describes this phenomena is discussed.

J. F. Whitacre

S. M. Yalisove

J. C. Bilello

In-Plane Texturing in Sputtered Films

The texture of electrodeposits vary with deposition conditions. Electrodeposits texture is
also related to microstructure, surface morphology and mechanical properties. When the
electrodeposits annealed, the recrystallization texture may be different from the original
deposition texture. The surface morphology, the microstructure and the initial and
recrystallization textures of nickel electrodeposits vary with deposition conditions.The <mml:math id="E1" xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mrow><mml:mrow><mml:mo>&#x2329;</mml:mo><mml:mrow><mml:mn>100</mml:mn></mml:mrow><mml:mo>&#x0232A;</mml:mo></mml:mrow></mml:mrow></mml:math> and <mml:math id="E2" xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mrow><mml:mrow><mml:mo>&#x2329;</mml:mo><mml:mrow><mml:mn>110</mml:mn></mml:mrow><mml:mo>&#x0232A;</mml:mo></mml:mrow></mml:mrow></mml:math> textures of nickel electrodeposits can be obtained from nickel sulfate,
nickel chloride and boric acid baths. The size of surface asperities decreases with increasing
current density and decreasing temperature. The <mml:math id="E3" xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mrow><mml:mrow><mml:mo>&#x2329;</mml:mo><mml:mrow><mml:mn>100</mml:mn></mml:mrow><mml:mo>&#x0232A;</mml:mo></mml:mrow></mml:mrow></mml:math> and <mml:math id="E4" xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mrow><mml:mrow><mml:mo>&#x2329;</mml:mo><mml:mrow><mml:mn>110</mml:mn></mml:mrow><mml:mo>&#x0232A;</mml:mo></mml:mrow></mml:mrow></mml:math> textures of nickel electrodeposits
changed to the <mml:math id="E5" xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mrow><mml:mrow><mml:mo>&#x2329;</mml:mo><mml:mrow><mml:mn>100</mml:mn></mml:mrow><mml:mo>&#x0232A;</mml:mo></mml:mrow></mml:mrow></mml:math> and <mml:math id="E6" xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mrow><mml:mrow><mml:mo>&#x2329;</mml:mo><mml:mrow><mml:msqrt><mml:mrow><mml:mn>3</mml:mn></mml:mrow></mml:msqrt></mml:mrow><mml:mi>10</mml:mi><mml:mo>&#x0232A;</mml:mo></mml:mrow></mml:mrow></mml:math> texture, when recrystallized, respectively.

Insoo Kim

Sae Gwang Lee

Initial and Recrystallization
Textures of Nickel Electrodeposits

Results of comprehensive studies into crystallographic texture of electrodeposited copper
coatings are presented in relation to their substructure, granular structure and surface
morphology. Quantitative texture evaluation involving anisotropy of substructure characteristics,
and determination of characteristics of substructure and granular structure
in the axial and random components are addressed. Effects of texture anisotropy of substructure
and texture nonhomogeneity of granular structure discovered in copper layers are
dealt with. Influence of the deposition current density on quantitative characteristics of
oriented structure in copper deposits is discussed. The effects of various thermodynamic
factors on texture formation in copper electroplates are considered for the stages of
(i) nucleation and (ii) growth of grains in the major component of texture. Anisotropy of
shape is also treated for the elements of oriented structure in copper electrodeposits.

O. B. Girin

Yu. O. Proshenko

E. P. Kalinushkin

Texture of Electrodeposited Copper Coatings as Related to Their
Substructure, Granular Structure and Surface Morphology

Thin films of La0.67M0.33MnO3 &#x28;M&#x3D;Sr&#x29;, LSMO were deposited on three different substrates of LAO, Sapphire, and Y-ZrO2 (YSZ) using metal&#x2013;organic chemical vapor deposition methods. The effect of texture and orientation on the resistance &#x28;0 and 6T&#x29; and magnetoresistance &#x28;MR&#x29; of &#x28;LSMO&#x29; thin films on various substrates has been investigated. X-ray pole figures were measured using Philips X&#x2019;Pert X-ray diffractometer equipped with the PopLa analysis package. A direct correlation was observed between the lattice mismatch strain and the structure of the thin film growth. LSMO&#x2F;LAO seems to be the most perfect system for epitaxial growth due to the negligible lattice-mismatch (&#x223C;2&#x25;). The dominant orientation changes for the films deposited on LAO &#x5B;100&#x5D; and LAO &#x5B;110&#x5D; substrates while the transition temperature from ferromagnetic to paramagnetic state of the film on LAO &#x5B;100&#x5D; is 50 K higher than that of the film on LAO &#x5B;100&#x5D;. The MR data and TMI temperature were measured using standard 4-point resistivity devices and SQUID.

H. Garmestani

X. Dong

L. Brandao

K. -H. Dahmen

Texture Analysis in LD-MOCVD Processed Thin Film Giant Magnetoresistant &#x28;LaM&#x29;MnO3 Materials

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Texture, Stress, and Microstructure

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Papers are published upon acceptance, regardless of the Special Issue publication date.

Texture, Stress, and Microstructure

Proceedings of the Symposium: Texture in Films and Coatings

Proceedings of the Symposium: Texture in Films and Coatings

Articles

The Microstructural Characterization of Electrogalvanized Zinc–Iron and Zinc–Nickel Coatings

The Evolution of Texture During Annealing of Nanocrystalline Electroless Nickel Alloy Deposits

Simulation of Texture Formation in a ZrO₂ Film Grown on Zr–2.5%Nb

Texture in Films and Coatings

Texture Control in Thin Films Using Ion Bombardment

The Growth of Oxide Scales on Textured Nickel

In-Plane Texturing in Sputtered Films

Initial and Recrystallization Textures of Nickel Electrodeposits

Texture of Electrodeposited Copper Coatings as Related to Their Substructure, Granular Structure and Surface Morphology

Texture Analysis in LD-MOCVD Processed Thin Film Giant Magnetoresistant (LaM)MnO₃ Materials