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VLSI Design
Volume 6, Issue 1-4, Pages 409-412
http://dx.doi.org/10.1155/1998/27636

Plasma Process Modeling for Integrated Circuits Manufacturing

Scientific Research Associates, Inc. P.O. Box 1058, Glastonbury 06033, CT, USA

Copyright © 1998 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

A reactor model for plasma-based deposition and etching is presented. Two-dimensional results are discussed in terms of plasma density, ion flux, and ion energy. Approaches to develop rapid CAD-type models are discussed.