Processing of Dielectric Optical Coatings by Nanosecond and Femtosecond UV Laser Ablation
Figure 5
Ablation depth versus fluence of 193 nm-single pulse rear side ablation of a 285 nm thick SiO layer on fused silica. In the range from 200 to 600 mJ/ (marked grey),
the complete layer is ablated; at fluences above 600 mJ/, in addition
material from the substrate is ablated.
