Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution

<div>The microstructure of the metal surfaces on different solders before (a), after (b), and distinct morphologies on specified points (c) after potentiodynamic polarization tests in 3.5 wt.% NaCl solution.</div>

International Journal of Corrosion

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Figure 4

Figure 4: Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution 