Research Article
Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution
Table 4
Cross-section element concentration of different solders after Potentiodynamic polarization tests in 3.5 wt.% NaCl solution.
| | Cross-section element concentration (atom%) | Sn | Ag | Cu | Ni | Pb | Cl | O |
| Sn-Cu-Ni | | | | | | | | Top layer | 63.99 | - | 0.60 | 0.22 | - | 0.92 | 33.91 | Inner layer | 98.59 | - | 1.27 | 0.14 | - | - | - | Sn-Ag-Cu | | | | | | | | Top layer | 40.95 | 1.12 | 0.17 | - | - | 0.15 | 57.27 | Inner layer | 97.36 | 2.01 | 0.63 | - | - | - | - | Sn-Cu | | | | | | | | Top layer | 64.58 | - | 0.72 | - | - | 0.60 | 33.35 | Inner layer | 99.30 | - | 0.70 | - | - | - | - | Sn-Pb | | | | | | | | Top layer | 6.85 | - | - | - | 3.91 | 0.91 | 88.03 | Inner layer | 60.16 | - | - | - | 39.84 | - | - | Sn | | | | | | | | Top layer | 32.62 | - | - | - | - | 0.37 | 66.41 | Inner layer | 99.85 | - | - | - | - | 0.15 | - |
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