Research Article

Utilization of Electroplating Sludge as Subgrade Backfill Materials: Mechanical and Environmental Risk Evaluation

Table 2

Experimental tests carried out.

MixtureBinder (%)MixtureBinder (%)
PCCFAWaterPCCFAWater

UCSLeaching
115051000
2200521008.5
3300531508.5
41515042008.5
52010053008.5
615155610208.5
720105715158.5
8151510820108.5
9201010