Numerical Modeling of Thermal-Dependent Creep Behavior of Soft Clays under One-Dimensional Condition

Figure 7

Predictions of the thermal oedometer test on Wenzhou clay with different temperatures: (a) compression curves at different temperatures; (b) strain-time curves for the case with = 80°C; (c) evolution of the thermal creep coefficient with normalized vertical stress; (d) comparisons of the thermal creep coefficient between intact and reconstituted clay.

(a)

(b)

(c)

(d)