Research Article
Coupled Effect of Curing Temperature and Moisture on THM Behavior of Cemented Paste Backfill
Table 2
Parameters and conditions used for model verification.
| Parameters and conditions | Values |
| Curing temperature (°C) | 30; 30; 10; 10; 20; 20 | Curing age (d) | 28 | Curing humidity (%) | 70; 70; 45; 95; 95; 95 | Thermal conductivity of the solid matrix (W/(m·K)) | 3.15 | Initial porosity of the CPB samples | 0.45 | Specific heat of the solid matrix (J/(kg·K)) | 1300 | Density of the solid matrix (kg/m3) | 2200 | Density of liquid water (kg/m3) | 1000 | Specific heat of liquid water (J/(kg·K)) | 4200 | Initial temperature of the CPB samples (°C) | 30; 30; 10; 10; 20; 20 | Initial humidity of the CPB samples (%) | 100 | Initial displacement field (m) | 0 | Initial structural velocity field (m/s) | 0 | Top surface | Confined deformation | Lateral sides | Free | Bottom side | Fixed | Volume force | Gravity |
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