Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling

<table class="table-group" id="tab2"><tr><td><table class="table"><tr><td class="thead-hr" colspan="4"><hr/></td></tr><tr class="thead"><td class="align_left">Methods</td><td class="align_center">C<sub>TSV-equiv</sub> (fF)</td><td class="align_center">R<sub>sub-equiv</sub> (Ω)</td><td class="align_center">C<sub>sub-equiv</sub> (fF)</td></tr><tr><td class="thead-hr" colspan="4"><hr/></td></tr><tr><td class="align_left">GAs</td><td class="align_center">192.375</td><td class="align_center">835.13</td><td class="align_center">16.94</td></tr><tr><td class="align_left">PSO</td><td class="align_center">197.12</td><td class="align_center">840.46</td><td class="align_center">15.72</td></tr><tr><td class="align_left">3D-TLM</td><td class="align_center">201.3</td><td class="align_center">928.5</td><td class="align_center">11.2</td></tr><tr class="table-tr"><td colspan="4"><hr class="tbody-hr"/></td></tr></table></td></tr></table>

<div>TSV-TSV noise coupling parameters using GA and 3D-TLM.</div>

Applied Computational Intelligence and Soft Computing

tab2

Table 2

Table 2: Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling 