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Applied Computational Intelligence and Soft Computing
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Applied Computational Intelligence and Soft Computing
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2021
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Article
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Tab 2
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Research Article
Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling
Table 2
TSV-TSV noise coupling parameters using GA and 3D-TLM.
Methods
C
TSV-equiv
(fF)
R
sub-equiv
(Ω)
C
sub-equiv
(fF)
GAs
192.375
835.13
16.94
PSO
197.12
840.46
15.72
3D-TLM
201.3
928.5
11.2