Photocatalytic Surface Modification of PI Film for Electroless Copper Plating

<table class="table-group" id="tab1"><tr><td><table class="table"><tr><td class="thead-hr" colspan="2"><hr/></td></tr><tr class="thead"><td class="align_left">Composition</td><td class="align_center">Content</td></tr><tr><td class="thead-hr" colspan="2"><hr/></td></tr><tr><td class="align_left">Copper sulfate (CuSO<sub>4</sub>·5H<sub>2</sub>O)</td><td class="align_center">10 g/L</td></tr><tr><td class="align_left">Ethylenediaminetetraacetic acid disodium salt (EDTA·2Na)</td><td class="align_center">30 g/L</td></tr><tr><td class="align_left">Formaldehyde (HCHO, 37%)</td><td class="align_center">3 ml/L</td></tr><tr><td class="align_left">2,2′-Dipyridyl</td><td class="align_center">15 mg/L</td></tr><tr><td class="align_left">Poly(ethylene glycol) (PEG 1000)</td><td class="align_center">0.5 g/L</td></tr><tr class="table-tr"><td colspan="2"><hr class="tbody-hr"/></td></tr></table></td></tr></table>

The compositions of the electroless copper plating bath.

Advances in Condensed Matter Physics

tab1

Table 1

Table 1: Photocatalytic Surface Modification of PI Film for Electroless Copper Plating 