Effect of Direct Current on Solid-Liquid Interfacial Tension and Wetting Behavior of Ga–In–Sn Alloy Melt on Cu Substrate

Figure 3

Typical liquid Ga–In–Sn drop shapes on Cu substrate under different conditions. Without DC after different standing time of (a) 5 min, (b) 35 min, and (c) 65 min, the three aforementioned drop shapes are amplified and overlapped in Figure (d). With positive DC (e) 0 A, (f) 6 A, and (g) 11 A, the three aforementioned drop shapes are amplified and overlapped in Figure (h). With negative DC (i) 0 A, (j) 6 A, and (k) 11 A, the three aforementioned drop shapes are amplified and overlapped in Figure (l).

(a)

(b)

(c)

(d)

(e)

(f)

(g)

(h)

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(j)

(k)

(l)