Effect of Direct Current on Solid-Liquid Interfacial Tension and Wetting Behavior of Ga–In–Sn Alloy Melt on Cu Substrate

<div class="floats-full-page floats-full-page-figure"><h2>Figure 4</h2><div class="floats-full-page-caption"><div>Contact angle versus current intensity and polarity.</div></div><div class="floats-full-page-content"><table class="figure-group"><tr class="fig-image"><td><object data="https://static-01.hindawi.com/articles/acmp/volume-2018/6328976/figures/6328976.fig.004.svgz" name="6328976.fig.004" type="image/svg+xml"></object></td></tr></table></div></div>

Figure 4 | Effect of Direct Current on Solid-Liquid Interfacial Tension and Wetting Behavior of Ga–In–Sn Alloy Melt on Cu Substrate

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Figure 4: Effect of Direct Current on Solid-Liquid Interfacial Tension and Wetting Behavior of Ga–In–Sn Alloy Melt on Cu Substrate

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Figure 4

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<p><em>Advances in Condensed Matter Physics</em> publishes research on the experimental and theoretical study of the physics of materials in solid, liquid, amorphous, and exotic states.</p>


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<p>Chief Editor, Professor Ulloa, is based at Ohio University and is a condensed matter theorist. His research is focussed on the electronic properties of nanostructures including quantum dots and nanowires, as well as proximity effects in 2D crystals.</p>


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