Research Article
Finite Element Stress Model of Direct Band Gap Ge Implementation Method Compatible with Si Process
Table 1
COMSOL simulation parameters.
| Material category | Young’s modulus (GPa) | Virtual thermal expansion coefficient (10−5/K) | Poisson’s ratio |
| Si | 162.91 | 0 | 0.28 | Si0.5Ge0.5 | 131.66 | 2.09 | 0.273 |
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