Numerical Simulation on Electrical-Thermal Properties of Gallium-Nitride-Based Light-Emitting Diodes Embedded in Board

<table class="table-group" width="800px"><tr class="fig-image" id="a"><td><img alt="495981.fig.001a" src="https://static.hindawi.com/articles/aoe/volume-2012/495981/figures/495981.fig.001a.jpg"/></td></tr><tr class="fig-caption"><td align="center"><table><tr><td><b>(a) </b> Photo of the 9-chip sample</td></tr></table></td></tr><tr class="fig-image" id="b"><td><img alt="495981.fig.001b" src="https://static.hindawi.com/articles/aoe/volume-2012/495981/figures/495981.fig.001b.jpg"/></td></tr><tr class="fig-caption"><td align="center"><table><tr><td><b>(b) </b> A chip packaging structure.</td></tr></table></td></tr></table>

<table>Proposed chips in board packaging method.</table>

Advances in OptoElectronics

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Figure 1

Figure 1: Numerical Simulation on Electrical-Thermal Properties of Gallium-Nitride-Based Light-Emitting Diodes Embedded in Board 