Advances in OptoElectronics / 2012 / Article / Fig 1

Research Article

Numerical Simulation on Electrical-Thermal Properties of Gallium-Nitride-Based Light-Emitting Diodes Embedded in Board

Figure 1

Proposed chips in board packaging method.
495981.fig.001a
(a) Photo of the 9-chip sample
495981.fig.001b
(b) A chip packaging structure.

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