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ElectroComponent Science and Technology
Volume 5, Issue 3, Pages 171-178
http://dx.doi.org/10.1155/APEC.5.171

Epoxies for Component Mounting in Thick Film Hybrids

Newmarket Transistors Ltd., Suffolk, Newmarket, UK

Received 15 July 1977; Accepted 7 March 1978

Copyright © 1978 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

Specialist conductive and non-conductive epoxies have been used in hybrid assembly since about 1970. Initially they were used as an alternative to eutectic bonding for the mounting of semiconductor chips, but they are now used for mounting a wide range of components. This paper looks at the performance of a wide range of epoxy mounted components, and considers many of the practical problems arising from the use of epoxies in production.