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ElectroComponent Science and Technology
Volume 5, Issue 4, Pages 215-218
http://dx.doi.org/10.1155/APEC.5.215

Improvement of Adhesion, Line Definition, Contact Resistance and Semiconductor Properties by Sputter-Etching

Institut für Netzwerk- und Systemtheorie, Universität Stuttgart, Seidenstr. 36, Stuttgart D- 7000, Germany

Received 12 June 1978

Copyright © 1979 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

T. Kallfass, “Improvement of Adhesion, Line Definition, Contact Resistance and Semiconductor Properties by Sputter-Etching,” ElectroComponent Science and Technology, vol. 5, no. 4, pp. 215-218, 1979. https://doi.org/10.1155/APEC.5.215.