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ElectroComponent Science and Technology
Volume 7, Issue 1-3, Pages 119-124

Ultrasonic Ball/Wedge Bonding of Aluminium Wires

The Welding Institute, Abington Hall, Abington, Cambridge CB1 6AL, United Kingdom

Received 13 February 1980

Copyright © 1980 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


The process of ball/wedge bonding and its advantages are described. A capacitor discharge technique for the formation of balls on 25 and 75 μm diameter aluminium wires is discussed. Ultrasonic welding trials were carried out and the bonds subjected to pull tests with good results. Bonds of good strength were made between 25 μm diameter Al-1% Si wire and Al thin films, Pd-Au thick films and Au flashed Kovar.