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ElectroComponent Science and Technology
Volume 7, Issue 1-3, Pages 149-154

Different Chip Interconnecting Techniques

Saab-Scania AB, Aerospace Division, Linköping 581 88, Sweden

Received 28 February 1980

Copyright © 1980 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


It is shown that in order to interconnect more than 25 I.C. chips (SSI and MSI) or to use LSI chips together with other kind of chips, the chips must be tested before mounting. Then only TAB- or CC-techniques can be used. The advantages and disadvantages of the different techniques are discussed.