Table of Contents Author Guidelines Submit a Manuscript
ElectroComponent Science and Technology
Volume 7 (1980), Issue 1-3, Pages 69-75

Application of Conductive Adhesives in Microcircuits for “Long-Life” Equipment

Philips' Telecommunicatie Industrie B.V., P.O. Box 18, Huizen 1270 AA, The Netherlands

Received 11 June 1979

Copyright © 1980 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


The results of a study of the application of conductive adhesives for attaching semiconductor chips to thin film Au conductors is presented.

The study concentrates on measuring the stability of the electrical conductivity of adhesive bonds for semiconductor chips.

Four types of conductive bonding agents and two types of semiconductor back metallization were tested at raised temperatures for up to 10,000 hours.