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ElectroComponent Science and Technology
Volume 9, Issue 2, Pages 125-130

Three Dimensional Analytical Separation of Grain Boundary and Surface Scatterings in Polycrystalline Metal Films in the Case of Non Cubic Grains

1Laboratoire d'Electronique, Université de NANCY, I C. O. 140 54037, Nancy-Cedex, France
2Laboratoire de Chronométrie et Piézoelectricité, E.N.S.M.M. Route de Gray, Besançon-Cedex 25030, France

Received 30 July 1980; Accepted 18 November 1980

Copyright © 1981 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Analytical approximate expressions for the resistivity and its temperature coefficient of thin polycrystalline metal films have been derived by considering separately the contributions of the grain-boundaries perpendicular to the x-, y- and z-axes. Provided that the grain-boundaries act as moderately efficient scatterers reasonable deviations from the three-dimensional model are obtained; an approximate model then seems convenient with which to perform the calculations of the strain coefficients of such fine-grained films.