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ElectroComponent Science and Technology
Volume 9, Issue 1, Pages 87-92

Reliability Considerations of Flip Chip Components for Automotive Electronic Applications

Sanken Electric Co. Ltd., Microelectronics Division, 677 Onohara Shimoakasaka, Saitama, Kawagoe, Japan

Copyright © 1981 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Electronic devices for automotive electronic applications have to be operated under extreme environmental conditions and therefore are required to have higher reliability compared with general electronic equipment. Recently automotive voltage regulators, ignition systems, etc. have been changing from mechanical constructions to electronic ones using thick film technology.

This paper presents results that shows that our flip chip IC technology can satisfy the high reliability requirements of automobile electronics.