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ElectroComponent Science and Technology
Volume 9 (1981), Issue 1, Pages 43-49

Considerations in Formulation and Manufacturing of Thick Film Inks

Engelhard Industries Division, Engelhard Minerals & Chemicals Corporation, East Newark 07029, New Jersey, USA

Copyright © 1981 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


This paper discusses considerations in formulation and manufacture of thick film inks. It deals with the components of thick film inks, their properties, functions, and manufacturing methods. The vehicle is defined and its components are discussed in terms of function, properties, and types. The various types of metals and their important properties are described and related to ink properties. Glass functions, types and properties are reviewed. Both vitreous and devitrifying glasses are examined. The usage of various types of oxides is discussed. Typical thick film inks are described. They include conductor, resistor, dielectric inks, and protective coatings. The types of components used are related to specific property requirements of each type of material. Ink manufacturing methods are described. Preparation of vehicle, metal powder, and glass frit is discussed. The process of incorporating these materials into an ink is detailed from initial mixing to final product. Testing, both in-process and final Q.C., is briefly discussed. The important considerations in both formulation and manufacturing are identified.