Active and Passive Electronic Components

Active and Passive Electronic Components / 1981 / Article

Open Access

Volume 9 |Article ID 956218 | https://doi.org/10.1155/APEC.9.131

J. Novotny, "Thick Film Circuits: Present State and Future Development", Active and Passive Electronic Components, vol. 9, Article ID 956218, 7 pages, 1981. https://doi.org/10.1155/APEC.9.131

Thick Film Circuits: Present State and Future Development

Received10 Nov 1980
Accepted11 May 1981

Abstract

Thick film technology has been known for about 20 years. The technique of inks, printing, firing and trimming has grown in this time to a well established state of the art. This paper gives an overview of the status today and an outlook into the future, not only for thick film, but also for hybrids built out of thick film circuits with incorporation of additional components. The paper gives the main market figures and market segments for thick film applications and mentions the main reasons for this. New fields of applications for thick film will be found in the future where considerations like reliability, space savings and cost advantage are of importance.

Copyright © 1981 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


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