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ElectroComponent Science and Technology
Volume 9, Issue 3, Pages 171-178
http://dx.doi.org/10.1155/APEC.9.171

Defect Density and Electrical Properties of Vacuum Evaporated Copper Films From Annealing Studies of Electrical Resistance

Department of Physics, Madras University Autonomous Post-Graduate Centre, Coimbatore 641 041, India

Received 20 February 1981; Accepted 10 September 1981

Copyright © 1982 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

K. Narayandas, M. Radhakrishnan, and C. Balasubramanian, “Defect Density and Electrical Properties of Vacuum Evaporated Copper Films From Annealing Studies of Electrical Resistance,” ElectroComponent Science and Technology, vol. 9, no. 3, pp. 171-178, 1982. https://doi.org/10.1155/APEC.9.171.