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ElectroComponent Science and Technology
Volume 10 (1982), Issue 1, Pages 31-49

Multi-Chip Module Technology

IBM Corporation, Hopewell Junction, NY, USA

Received 6 January 1982; Accepted 22 March 1982

Copyright © 1982 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


The paper describes the key design features and outlines the manufacturing process for multi-chip ceramic modules used in recently announced IBM products. Emphasis is placed on the thermal conduction module (TCM) which is used in the IBM 3081 computer and incorporates the most advanced substrate and module technologies at IBM. The 90 mm × 90 mm TCM substrate contains up to 32 ceramic layers and typically 130M of impedance controlled wiring to interconnect up to 118 LSI logic and array devices. The TCM is designed to provide a cooling capacity of up to 300W. Key manufacturing challenges are highlighted.