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ElectroComponent Science and Technology
Volume 10, Issue 1, Pages 51-55

Density Upgrading in Tape Automated Bonding

1CII-Honeywell Bull Avenue Jean Jaurès, Les Clayes S/BOIS 78340, France
2CII-Honewell Gull 20, rue Dieumegard, Saint-OUEN 93406, France

Received 12 November 1981

Copyright © 1982 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Bondig technique developed by CII-Honeywell Bull. The paper describes the geometry of bonding pads at the chip level, the design and realization of the corresponding high density 35 mm tape and the interconnection of the chips on the tape (inner lead bonding – ILB). Two alternatives of chip mounting on the substrate are also mentioned.