Active and Passive Electronic Components

Active and Passive Electronic Components / 1985 / Article

Open Access

Volume 12 |Article ID 021431 | https://doi.org/10.1155/1985/21431

Maria Prudenziati, Bruno Morten, Maria Franca Brigatti, "Evolution of the Microstructure and Performance of Pd/Ag - Based Thick Conductors", Active and Passive Electronic Components, vol. 12, Article ID 021431, 17 pages, 1985. https://doi.org/10.1155/1985/21431

Evolution of the Microstructure and Performance of Pd/Ag - Based Thick Conductors

Received20 Apr 1984
Accepted18 Sep 1984

Abstract

Pd/Ag-based inks are probably the most commonly used conductors in thick-film hybrid technology. The evolution of the microstructure of these films was studied on samples fired with isochronal cycles at a peak temperature in the range from 300℃ up to 850℃. The samples were investigated by means of X-ray diffraction, SEM and EDAX analysis techniques; the results of these analyses as well as those of thermogravimetry (TG, DTG) and differential thermal analysis (DTA), enable one to obtain a clear picture of the complex evolution of the microstructure of these conductors, which correlates quite strictly with the performance of the films in terms of resistivity and adhesion.The relevance and limitations of each analytical technique for the examination of thick-film conductors are emphasized.

Copyright © 1985 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


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