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ElectroComponent Science and Technology
Volume 11, Issue 4, Pages 291-297

Stability Observations and Surface Analysis of Air Fired Nickel Thick Film Conductors

1Telecommunication Department, Higher Institute of Mechanical and Electrical Engineering, Sofia 1156, Bulgaria
2Electronic. Elec. Eng. Dept., Loughborough University of Technology, Leics, Loughborough, UK

Received 8 November 1982; Accepted 12 February 1984

Copyright © 1985 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


The results from an investigation of the properties of air fired Nickel thick film produced with conductive paste ESL 2554 on 96% Al2O3 substrates are described. The analysis of the possible causes of instability of this thick film material has been done using the methods of surface analysis. The picture of the film surface structure obtained as a result of surface analysis shows a non-isotropic distribution of the metal and glass phase. For a firing peak temperature of 650℃ there is little nickel present at the film surface, and this could be the main cause of the high instability and low adhesion observed. To obtain a stable film the maximum firing peak temperature has been established at 580℃. This has been confirmed by comparing the surface analysis results from films prepared at 650℃ and 580℃ peak temperatures.

The surface analysis of the substrate shows the presence of Silicon which may be considered as another possible cause of film instability.