Toshio Inokuma, Yoshiaki Taketa, Miyoshi Haradome, "The Relationship Between the Electrical Properties of Thick Film Resistors and the Thermal Expansion Coefficient of the Substrates", Active and Passive Electronic Components, vol. 12, Article ID 065302, 7 pages, 1987. https://doi.org/10.1155/1987/65302
The Relationship Between the Electrical Properties of Thick Film Resistors and the Thermal Expansion Coefficient of the Substrates
The temperature characteristics of RuO2-based thick film resistors on various substratcs having different thermal expansion coefficient have been investigated.It became clear that, if the thermal expansion coefficient of the substrate is larger than that of the thick film resistor, a compression is being exerted by the substrate on the as-fired resistor at low temperature. As temperature rises, the resistance value increases, and the TCR becomes positive.On the contrary, if the thermal expansion coefficient of the resistor is larger than that of the substrate, the as-fired resistor is being stretched by the substrate at low temperature. As temperature rises, the resistancc value decreases, and the TCR becomes negative.
Copyright © 1987 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.