Active and Passive Electronic Components

Active and Passive Electronic Components / 1988 / Article

Open Access

Volume 13 |Article ID 062434 | https://doi.org/10.1155/1988/62434

M. M. Mandhare, S. A. Gangal, M. S. Setty, R. N. Karekar, "Performance Comparison of Thin and Thick Film Microstrip Rejection Filters", Active and Passive Electronic Components, vol. 13, Article ID 062434, 10 pages, 1988. https://doi.org/10.1155/1988/62434

Performance Comparison of Thin and Thick Film Microstrip Rejection Filters

Received11 Jun 1987

Abstract

A performance comparison of microstripline circuits using thin and thick film techniques has been studied, in which a Microstrip rejection filter, in the X-band of microwaves, is used as test circuit. A thick film technique is capable of giving good adhesive films with comparable d.c. sheet resistivity, but other parameters such as open area (porosity), particle size, and edge definition are inferior to thin-film microstrip filters. Despite this drawback, the average value of transmission, transmission loss, reflection coefficient, resonant rejection frequency, and quality factor for thick-film filters indicate that screen printed Ag films are intermediate between thin-film1,2,9 and etched-thick-film9 microstrip filters in performance, making it a feasible method for microstrip circuits.

Copyright © 1988 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


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