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Active and Passive Electronic Components
Volume 14 (1992), Issue 4, Pages 245-249
http://dx.doi.org/10.1155/1992/20790

Evaporation of Adherent Al-Films on Single Crystalline LiNbO3 Substrates

Department of Electrotechnics, Technical University, Wismar 0-2400, Germany

Copyright © 1992 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

LiNbO3 is used as a single crystalline substrate material for the manufacturing of surface acoustic wave devices as frequency selective components. On the polished substrate wafer, Al with a film thickness of about 400 nm is evaporated in a high vacuum.

The difficulties of the inadequate adhesion of the structured Al-film were eliminated by systematical investigations. Films that were adherent to the total surface could be prepared by evaporating an intermediate film of Cr or SiOx or, otherwise, a mixed film of Al with Si.

An ultrasonic test for adhesion strength was developed that results in an assessment of local and also large-area film adhesion.