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Active and Passive Electronic Components
Volume 15, Issue 1, Pages 27-31

Reliability Prediction of Thick Film Hybrid Integrated Circuits

1Technical University Sofia, Department of Electronics Technology, Sofia 1756, Bulgaria
2Plant for Capacitors, Kyustendil 2500, Bulgaria

Received 12 July 1991; Accepted 23 October 1991

Copyright © 1992 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


When using the well known handbooks for reliability predicting (MIL, CNET) some problems occur in quality assessment of components which are not produced according to the requirements of the US military or the French standards. The results obtained from tests of Test Pattern Circuits may be used successfully for reliability estimating during the design period of new thick film Hybrid Integrated Circuits. Six types of Test Pattern Circuits were designed and tested and a model for estimating thick film Hybrid Integrated Circuits failure rate is proposed. Failure rate values predicted by using the method with Test Pattern Circuits, and the results, obtained from the tests of two kinds of Hybrid Integrated Circuits concerned for a 90% confidence level were compared.