Abstract
When using the well known handbooks for reliability predicting (MIL, CNET) some problems occur in quality assessment of components which are not produced according to the requirements of the US military or the French standards. The results obtained from tests of Test Pattern Circuits may be used successfully for reliability estimating during the design period of new thick film Hybrid Integrated Circuits. Six types of Test Pattern Circuits were designed and tested and a model for estimating thick film Hybrid Integrated Circuits failure rate is proposed. Failure rate values predicted by using the method with Test Pattern Circuits, and the results, obtained from the tests of two kinds of Hybrid Integrated Circuits concerned for a 90% confidence level were compared.