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Active and Passive Electronic Components
Volume 17, Issue 2, Pages 67-77

Thermal Placement in Hybrid Circuits—A Heuristic Approach

Laboratory of Electronics, Ghent State University, Sint Pietersnieuwstraat 41, Ghent 9000, Belgium

Received 10 February 1994; Accepted 11 March 1994

Copyright © 1994 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


This paper deals with the placement of heat dissipating components in hybrid circuits. An optimum placement is found when the extreme temperatures on the substrate are minimized. Whereas classical techniques such as the gradient method require large computational efforts, a simple and very rapid heuristic method is presented here. The heuristic approach offers the advantage that it can be easily inserted in the design phase of the circuit.