Thermal Placement in Hybrid Circuits—A Heuristic Approach

Abstract

This paper deals with the placement of heat dissipating components in hybrid circuits. An optimum placement is found when the extreme temperatures on the substrate are minimized. Whereas classical techniques such as the gradient method require large computational efforts, a simple and very rapid heuristic method is presented here. The heuristic approach offers the advantage that it can be easily inserted in the design phase of the circuit.