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Active and Passive Electronic Components
Volume 2011 (2011), Article ID 823654, 8 pages
Research Article

Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate

1Department of Mechanics System Engineering, Toyama Prefectural University, Imizu 939-0398, Japan
2COSEL CO. LTD., 1-6-43 Kamiakae-machi, Toyama 930-0816, Japan

Received 12 April 2011; Revised 4 August 2011; Accepted 6 September 2011

Academic Editor: P. Markondeya Raj

Copyright © 2011 Masaru Ishizuka et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


In recent years, there is a growing demand to have smaller and lighter electronic circuits which have greater complexity, multifunctionality, and reliability. High-density multichip packaging technology has been used in order to meet these requirements. The higher the density scale is, the larger the power dissipation per unit area becomes. Therefore, in the designing process, it has become very important to carry out the thermal analysis. However, the heat transport model in multichip modules is very complex, and its treatment is tedious and time consuming. This paper describes an application of the thermal network method to the transient thermal analysis of multichip modules and proposes a simple model for the thermal analysis of multichip modules as a preliminary thermal design tool. On the basis of the result of transient thermal analysis, the validity of the thermal network method and the simple thermal analysis model is confirmed.