Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate

<table>Value <svg height="10.325" id="M68" style="vertical-align:-0.0pt" version="1.1" viewbox="0 0 12.7 10.325" width="12.7" xmlns="http://www.w3.org/2000/svg">
<g transform="matrix(1.25,0,0,-1.25,0,10.325)">
<g transform="translate(72,-63.74)">
<text transform="matrix(1,0,0,-1,-71.95,63.79)">
<tspan style="font-size: 12.50px; " x="0" y="0">𝐷</tspan>
</text>
</g>
</g>
</svg> in natural heat transfer equation (<a href="https://static.hindawi.com/articles/apec/volume-2011/823654/figures/#EEq5">5</a>).</table>

Active and Passive Electronic Components

fig7

Figure 7

Figure 7: Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate 