Research Article
Thermal-Aware Test Schedule and TAM Co-Optimization for Three-Dimensional IC
Table 3
The third test case.
| Die | Circuit | Die area (mm2) | Die power (W) |
| Die 4 | t512505 | 4.92 × 4.95 | 34.08 | Die 3 | a586710 | 3.72 × 3.69 | 17.22 | Die 2 | q12710 | 2.99 × 2.79 | 11.65 | Die 1 | h953 | 1.09 × 1.61 | 2.46 | Die 0 | g1023 | 1.23 × 1.32 | 2.28 |
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