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Active and Passive Electronic Components
Volume 2016 (2016), Article ID 6295405, 7 pages
http://dx.doi.org/10.1155/2016/6295405
Research Article

The Design and Thermal Reliability Analysis of a High-Efficiency K-Band MMIC Medium-Power Amplifier with Multiharmonic Matching

1School of Aeronautics and Astronautics, Zhejiang University, No. 38 Zheda Road, Hangzhou 310027, China
2Hangzhou College of Commerce, Zhejiang Gongshang University, No. 18, Xuezheng Street, Hangzhou 310018, China

Received 18 March 2016; Accepted 21 April 2016

Academic Editor: Gerard Ghibaudo

Copyright © 2016 Y. Shang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

A new high-efficiency K-band MMIC medium-power amplifier (PA) is designed with multiharmonic matching using GaAs pHEMT process technology. It has an operation frequency centered at 26 GHz with a bandwidth of 2 GHz. A 20 dBm 1 dB-compression-point output power and 40% efficiency are achieved. A novel thermal reliability analysis method based on ICEPAK is proposed also to evaluate its thermal characteristic. The test result by using a QFI InfraScope infrared imaging system is compared with the simulation result. It agrees well with an accuracy within ±1°C differences, which reflects the advantages of the thermal analysis method with respect to accuracy and convenience for use.