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Active and Passive Electronic Components
Volume 2016, Article ID 6295405, 7 pages
http://dx.doi.org/10.1155/2016/6295405
Research Article

The Design and Thermal Reliability Analysis of a High-Efficiency K-Band MMIC Medium-Power Amplifier with Multiharmonic Matching

1School of Aeronautics and Astronautics, Zhejiang University, No. 38 Zheda Road, Hangzhou 310027, China
2Hangzhou College of Commerce, Zhejiang Gongshang University, No. 18, Xuezheng Street, Hangzhou 310018, China

Received 18 March 2016; Accepted 21 April 2016

Academic Editor: Gerard Ghibaudo

Copyright © 2016 Y. Shang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Y. Shang, H. Xu, J. Mo, et al., “The Design and Thermal Reliability Analysis of a High-Efficiency K-Band MMIC Medium-Power Amplifier with Multiharmonic Matching,” Active and Passive Electronic Components, vol. 2016, Article ID 6295405, 7 pages, 2016. https://doi.org/10.1155/2016/6295405.