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Active and Passive Electronic Components
Volume 2017, Article ID 9703029, 10 pages
https://doi.org/10.1155/2017/9703029
Research Article

Investigation and Analysis of the Simultaneous Switching Noise in Power Distribution Network with Multi-Power Supplies of High Speed CMOS Circuits

1Laboratory of Electrical Systems and Telecommunications, Department of Physics, Faculty of Sciences and Technology, Cadi Ayyad University, Marrakesh, Morocco
2Department of Electrical Engineering, Royal Air Academy (ERA), Marrakesh, Morocco

Correspondence should be addressed to Khaoula Ait Belaid; moc.liamg@aluoahk.dialebtia

Received 9 June 2017; Accepted 17 August 2017; Published 28 September 2017

Academic Editor: Gerard Ghibaudo

Copyright © 2017 Khaoula Ait Belaid et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Linked References

  1. R. R. Tummala, “SOP: what is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade,” IEEE Transactions on Advanced Packaging, vol. 27, no. 2, pp. 241–249, 2004. View at Publisher · View at Google Scholar · View at Scopus
  2. B. Garben, R. Frech, and J. Supper, “Simulations of frequency dependencies of delta-I noise,” in Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 199–202, Cambridge, MA, USA, 2001. View at Scopus
  3. I. Novak, “Lossy power distribution networks with thin dielectric layers and/or thin conductive layers,” IEEE Transactions on Advanced Packaging, vol. 23, no. 3, pp. 353–360, 2000. View at Publisher · View at Google Scholar · View at Scopus
  4. L. Smith, T. Roy, and R. Anderson, “Power plane SPICE models for frequency and time domains,” in Proceedings of the IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 51–54, Scottsdale, AZ, USA, 2000. View at Publisher · View at Google Scholar
  5. S. Chun, J. Kim, N. Na, and M. Swaminathan, “Comparison of methods for modeling ALANs power plane structure,” Packag, pp. 247–250, 2000. View at Google Scholar
  6. S. Chun, M. Swaminathan, L. D. Smith, J. Srinivasan, Z. Jin, and M. K. Iyer, “Modeling of simultaneous switching noise in high speed systems,” IEEE Transactions on Advanced Packaging, vol. 24, no. 2, pp. 132–142, 2001. View at Publisher · View at Google Scholar · View at Scopus
  7. J.-H. Kim and M. Swaminathan, “Modeling of irregular shaped power distribution planes using transmission matrix method,” IEEE Transactions on Advanced Packaging, vol. 24, no. 3, pp. 334–336, 2001. View at Publisher · View at Google Scholar · View at Scopus
  8. H. Kim, Y. Jeong, J. Park et al., “Significant reduction of power/ground inductive impedance and simultaneous switching noise by using embedded film capacitor,” in Proceedings of the Electrical Performance of Electronic Packaging, '03, pp. 129–132, Princeton, NJ, USA, 2003. View at Publisher · View at Google Scholar · View at Scopus
  9. J. M. Hobbs, H. Windlass, V. Sundaram et al., “Simultaneous switching noise suppression for high speed systems using embedded decoupling,” Proceedings - Electronic Components and Technology Conference, pp. 339–343, 2001. View at Publisher · View at Google Scholar · View at Scopus
  10. R. Abhari and G. V. Eleftheriades, “Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits,” IEEE Transactions on Microwave Theory and Techniques, vol. 51, no. 6, pp. 1629–1639, 2003. View at Publisher · View at Google Scholar · View at Scopus
  11. T.-L. Wu, S.-T. Chen, J.-N. Hwang, and Y.-H. Lin, “Numerical and experimental investigation of radiation caused by the switching noise on the partitioned dc reference planes of high speed digital PCB,” IEEE Transactions on Electromagnetic Compatibility, vol. 46, no. 1, pp. 33–45, 2004. View at Publisher · View at Google Scholar · View at Scopus
  12. T.-H. Ding and Y.-S. Li, “Efficient method for modeling of SSN using time-domain impedance function and noise suppression analysis,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 2, no. 3, pp. 510–520, 2012. View at Publisher · View at Google Scholar · View at Scopus
  13. L. D. Smith, “Power distribution system design methodology and capacitor selection for modem cmos technology,” IEEE Transactions on Advanced Packaging, vol. 22, no. 3, pp. 284–291, 1999. View at Publisher · View at Google Scholar · View at Scopus
  14. B. Gustavsen and A. Semlyen, “Rational approximation of frequency domain responses by vector fitting,” IEEE Transactions on Power Delivery, vol. 14, no. 3, pp. 1052–1061, 1999. View at Publisher · View at Google Scholar · View at Scopus
  15. B. Gustavsen, “Fast passivity enforcement for pole-residue models by perturbation of residue matrix eigenvalues,” IEEE Transactions on Power Delivery, vol. 23, no. 4, pp. 2278–2285, 2008. View at Publisher · View at Google Scholar · View at Scopus
  16. P. Triverio, S. Grivet-Talocia, M. S. Nakhla, F. G. Canavero, and R. Achar, “Stability, causality, and passivity in electrical interconnect models,” IEEE Transactions on Advanced Packaging, vol. 30, no. 4, pp. 795–808, 2007. View at Publisher · View at Google Scholar · View at Scopus
  17. M. Popovich and E. G. Friedman, “Decoupling capacitors for multi-voltage power distribution systems,” IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 14, no. 3, pp. 217–228, 2006. View at Publisher · View at Google Scholar · View at Scopus
  18. B. Hassan and S. Mouloud, “Analysis and optimization of power integrity issues from high speed CMOS integrated circuit interactions in aeronautic systems,” in Proceedings of the 13th International Multi-Conference on Systems, Signals and Devices, SSD '16, pp. 636–639, Leipzig, Germany, 2016. View at Publisher · View at Google Scholar · View at Scopus
  19. H. W. Ott, Electromagnetic Compatibility Engineering, John Wiley & Sons, Inc., Hoboken, NJ, USA, 2009. View at Publisher · View at Google Scholar
  20. B. Gustavsen and H. M. J. De Silva, “Inclusion of rational models in an electromagnetic transients program: Y-Parameters, Z-Parameters, S-parameters, transfer functions,” IEEE Transactions on Power Delivery, vol. 28, no. 2, pp. 1164–1174, 2013. View at Publisher · View at Google Scholar · View at Scopus