Journals
Publish with us
Publishing partnerships
About us
Blog
Active and Passive Electronic Components
Journal overview
For authors
For reviewers
For editors
Table of Contents
Special Issues
Active and Passive Electronic Components
/
2019
/
Article
/
Fig 10
/
Research Article
Design Tradeoff of Hot Carrier Immunity and Robustness in LDMOS with Grounded Gate Shield
Figure 10
TLP test results of different gate shield structures.
