Preparation and Characterization of Printed LTCC Substrates for Microwave Devices

<table class="fixed-width table-group" id="tab1"><tr><td><table class="table"><colgroup><col style="width:13.93em"/><col style="width:10.92em"/><col style="width:4.42em"/></colgroup><tr><td class="thead-hr" colspan="3"><hr/></td></tr><tr class="thead"><td class="align_left">Properties</td><td class="align_center">This work</td><td class="align_center">DuPont</td></tr><tr><td class="thead-hr" colspan="3"><hr/></td></tr><tr><td class="align_left">Composition</td><td class="align_center">60 %BSG+40 %alumina</td><td class="align_center">951</td></tr><tr><td class="align_left">Sintering temperature (°C)</td><td class="align_center">875</td><td class="align_center">-</td></tr><tr><td class="align_left">Relative Density (%)</td><td class="align_center">93.7</td><td class="align_center">-</td></tr><tr><td class="align_left">Dielectric constant, <i><i>Ɛ</i>r</i> (3 GHz)</td><td class="align_center">6.2</td><td class="align_center">7.8</td></tr><tr><td class="align_left">Dielectric loss, <svg height="11.439pt" id="M4" style="vertical-align:-2.15067pt" version="1.1" viewbox="-0.0498162 -9.28833 39.6503 11.439" width="39.6503pt" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink"><g transform="matrix(.013,0,0,-0.013,0,0)"><path d="M384 0V27C293 34 287 42 287 114V635C232 613 172 594 109 583V559L157 557C201 555 205 550 205 499V114C205 42 199 34 109 27V0H384Z"></path></g><g transform="matrix(.013,0,0,-0.013,6.24,0)"><path d="M368 703H309L44 -163H104L368 703Z"></path></g><g transform="matrix(.013,0,0,-0.013,13.78,0)"><path d="M298 36L289 62C276 55 253 45 228 45C202 45 169 60 169 141V397H276C289 405 292 426 282 437H169V574L155 576L90 509V437H45L17 408L21 397H90V107C90 28 125 -12 188 -12C198 -12 213 -8 230 1L298 36Z"></path></g><g transform="matrix(.013,0,0,-0.013,17.824,0)"><path d="M433 39L423 65C413 59 399 54 387 54C370 54 352 69 352 114V299C352 352 342 392 307 422C285 440 255 449 225 449C168 437 102 399 75 379C56 365 44 353 44 339C44 315 69 296 87 296C101 296 111 303 116 319C124 349 133 371 145 385C156 397 171 404 190 404C241 404 275 364 275 291V274C253 256 180 229 120 209C65 190 39 159 39 110C39 47 88 -12 159 -12C189 -12 237 25 277 52C282 35 288 21 301 8C312 -3 333 -12 348 -12L433 39ZM275 84C256 65 221 48 195 48C164 48 124 73 124 124C124 161 146 180 185 198C206 208 254 229 275 240V84Z"></path></g><g transform="matrix(.013,0,0,-0.013,23.413,0)"><path d="M524 0V26C466 32 460 36 460 104V297C460 393 411 449 331 449C302 449 276 437 248 419C223 402 201 387 181 372V451C137 432 90 420 42 411V388C96 378 102 374 102 310V104C102 38 97 33 29 26V0H246V26C187 32 181 36 181 104V339C211 365 250 390 290 390C357 390 381 345 381 276V109C381 40 374 32 315 26V0H524Z"></path></g><g transform="matrix(.013,0,0,-0.013,32.766,0)"><path d="M494 514C482 587 419 712 303 712C238 712 174 667 174 603C174 561 205 514 249 449C219 438 187 422 162 407C93 366 23 283 23 177C23 69 87 -12 190 -12C244 -12 288 5 328 33C406 87 444 170 444 249C444 329 404 391 331 475C265 550 222 605 222 627C222 647 238 657 267 657C355 657 421 585 484 499L494 514ZM359 234C359 143 319 30 219 30C172 30 114 75 114 178C114 275 163 343 195 378C212 397 241 415 269 425C305 382 359 313 359 234Z"></path></g></svg> (3 GHz)</td><td class="align_center">0.0055</td><td class="align_center">0.006</td></tr><tr><td class="align_left">Bending strength (mPa)</td><td class="align_center">156</td><td class="align_center">-</td></tr><tr class="table-tr"><td colspan="3"><hr class="tbody-hr"/></td></tr></table></td></tr></table>

<div>Properties of printed glass-ceramic substrate.</div>

Active and Passive Electronic Components

tab1

Table 1

Table 1: Preparation and Characterization of Printed LTCC Substrates for Microwave Devices 