Preparation of Polypropylene Powder by Dissolution-Precipitation Method for Selective Laser Sintering

<table class="fixed-width table-group" id="tab2"><tr><td><table class="table"><colgroup><col style="width:10.33em"/><col style="width:21.93em"/></colgroup><tr><td class="thead-hr" colspan="2"><hr/></td></tr><tr class="thead"><td class="align_left">Fittings of a machine</td><td class="align_center">Performance parameters</td></tr><tr><td class="thead-hr" colspan="2"><hr/></td></tr><tr><td class="align_left">Laser</td><td class="align_center">CO<sub>2</sub>, 30W</td></tr><tr><td class="align_left">Scanning system</td><td class="align_center">F-theta lens, high speed vibrating mirror, 4m/s</td></tr><tr><td class="align_left">Layer thickness</td><td class="align_center">0.08-0.2mm</td></tr><tr><td class="align_left">Accuracy</td><td class="align_center">±0.2mm</td></tr><tr><td class="align_left">SLS chamber size</td><td class="align_center">320mm×320mm×650mm</td></tr><tr><td class="align_left">Powder laying method</td><td class="align_center">Automatic powder delivery, two-way powder laying</td></tr><tr><td class="align_left">Forming material</td><td class="align_center">Polymer powders such as PS, PP, PA6, and PA12</td></tr><tr><td class="align_left">Control software</td><td class="align_center">HUST 3DP</td></tr><tr><td class="align_left">Mainframe size</td><td class="align_center">1950mm×1150mm×2350mm</td></tr><tr class="table-tr"><td colspan="2"><hr class="tbody-hr"/></td></tr></table></td></tr></table>

<div>Performance parameters of HK P320 laser sintering system.</div>

Advances in Polymer Technology

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Table 2

Table 2: Preparation of Polypropylene Powder by Dissolution-Precipitation Method for Selective Laser Sintering 