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Bioinorganic Chemistry and Applications
Volume 2016, Article ID 4792583, 11 pages
Research Article

Effect of Ag Addition on the Electrochemical Performance of Cu10Al in Artificial Saliva

1Facultad de Ciencias Químicas e Ingeniería, Universidad Autónoma del Estado de Morelos, Avenida Universidad 1001, 62209 Cuernavaca, MOR, Mexico
2CIICAp, Universidad Autónoma del Estado de Morelos, Avenida Universidad 1001, 62209 Cuernavaca, MOR, Mexico
3Instituto de Ciencias Físicas, Universidad Nacional Autónoma de México, Avenida Universidad s/n, 62210 Cuernavaca, MOR, Mexico
4Universidad Politécnica del Estado de Morelos, Boulevard Cuauhnahuac 566, Col. Lomas del Texcal, 62574 Jiutepec, Morelos, Mexico
5Instituto de Investigaciones Eléctricas, Avenida Reforma 113, Colonia Palmira, 62490 Cuernavaca, MOR, Mexico
6Corrosion y Protección (CyP), Buffon 46, 11590 México City, DF, Mexico

Received 4 May 2016; Revised 25 July 2016; Accepted 31 July 2016

Academic Editor: Imre Sovago

Copyright © 2016 R. J. Salgado-Salgado et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


In this work we proposed to evaluate the corrosion resistance of four different alloys by electrochemical techniques, a binary alloy Cu10Al, and three ternary alloys Cu10Al-Ag ( = 5, 10, and 15 wt.%) to be used like biomaterials in dental application. Biomaterials proposed were tested in artificial saliva at 37°C for 48 h. In addition, pure metals Cu, Al, Ag, and Ti as reference materials were evaluated. In general the short time tests indicated that the Ag addition increases the corrosion resistance and reduces the extent of localized attack of the binary alloy. Moreover, tests for 48 hours showed that the Ag addition increases the stability of the passive layer, thereby reducing the corrosion rate of the binary alloy. SEM analysis showed that Cu10Al alloy was preferably corroded by grain boundaries, and the Ag addition modified the form of attack of the binary alloy. Cu-rich phases reacted with SCN anions forming a film of CuSCN, and the Ag-rich phase is prone to react with SCN anions forming AgSCN. Thus, binary and ternary alloys are susceptible to tarnish in the presence of thiocyanate ions.