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BioMed Research International
Volume 2018, Article ID 3039251, 6 pages
Research Article

Effect of Surface Coating on Bond Strength between Etched Feldspar Ceramic and Resin-Based Luting Agents

Department of Restorative Dentistry, Graduate Program in Dentistry, Meridional Faculty, IMED, 99070-220 Passo Fundo, Brazil

Correspondence should be addressed to Aloísio O. Spazzin; rb.ude.demi@nizzaps.oisiola

Received 13 April 2018; Accepted 10 July 2018; Published 24 July 2018

Academic Editor: Konstantinos Michalakis

Copyright © 2018 Jader Sebben et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


This study evaluated adhesive protocols (silane, silane and unfilled resin, and universal adhesive) of bond strength between feldspar ceramic and resin-based luting agents (RBLAs). Thirty ceramic disks were embedded into acrylic resin, polished, etched, and randomly divided into 6 groups: S-RC: silane (S) and light-cured resin cement (RC) (RelyX Veneer; 3M ESPE); SB-RC: S followed by bond (B) (Clearfil SE Bond, Kuraray) and RC; UA-RC: universal adhesive (UA) (Single Bond Universal; 3M ESPE) and RC; flowable composite resin (F) was used on groups S-F, SB-F, and UA-F, and luting agent cylinders were built. The response variables (n=20) were microshear bond strength (MPa), characteristic strength (σ0, MPa), and Weibull modulus (m). The RC groups presented similar bond strengths regardless of whether or not bond was used. The S-F group with only silane application showed the highest bond strength, while the universal adhesive showed the lowest bond strength. The reliability was only affected in the UA-RC group, which was lower than the S-F group. Silane application is fundamental since the universal adhesive only decreased the bond strength between the feldspar ceramic and the RBLAs. Overall, the use of unfilled resin did not positively influence bond strength.